DAI GENKI PTE LTD

Business Description

DAI GENKI PTE LTD is registered as a business entity on 07 March 1988 (37.0 years ago) structured as a Exempt Private Company Limited By Shares (Local Company) with 4 officer(s) in-charge. The business jurisdiction is overseen by the Accounting and Corporate Regulatory Authority (ACRA), a government agency from Singapore with the given Business Registration Number / Unique Entity Number (UEN) 198800707E. The business official address is located at 135 Middle Road #05-13, Bylands Building, Singapore 188975 with main trading activity as Providing Heat Treatment Material Testing & Other Engineering Services in the primary industry of 25921: Electroplating And Plating Of Metals And Formed Products using Singapore Dollars - SGD as its default trading currency. The business legal name has undergone change(s) and is previously known as TESE PTE LTD, BOLE HEAT TREATMENT PTE LTD. The business annual account filing date falls on 31 May and is no longer operational with the status of 'Struck Off'. The business paid up share capital is SGD 2, with preference share capital of SGD 0, and other share capital at SGD 0.

In the past 365 days, DAI GENKI PTE LTD has received a total of Login to view reported payment review(s). 0 were rated Good and Login to view were rated Poor. Therefore no payment reviews were made recently. The aggregated good payment amount is equivalent to USD 0, and aggregated poor payment amount is equivalent to USD Login to view. Its current payment rating of "D" suggest a bad payment culture where settlement with stakeholders is frequently past due. Since the business is no longer active, please take caution if you continue transacting as a counter-party. The appointment of BDO LLP as auditor indicates that the business is medium to large sized as it is required to meet additional regulatory requirements either due to reported revenue or assets exceeding SGD 10 million or has more than 50 employees in the previous two fiscal years.

DAI GENKI PTE LTD is not yet a Prompt Payment Initiative Signatory.

Last updated on 30 April 2023